Process Capability

Capability of Rigid board

 No.

 Type

 Standard

 1

 Normal FR4/Halogen free/
 High Tg FR4/ Aluminum

 KB,Shengyi, ITEQ,Isola,
 Nelco,Ventec,Tuc,Elite,
 Panasonic, Getek,NanYa,
 Bergquist,laird

 2

 PTFE Laminates

 Rogers series、Taconic series、
 Arlon series、Nelco series、
 Taizhou Wangling F4BK
 series、TP series;

 3

 Hybrid laminating

 Rogers/Taconic/Arlon/Nelco
 laminate with FR-4 material - 
 including partial Ro4350B hybrid
 laminating with FR-4

 4

 Multilayers

 4-64 layers, board thickness 
 0.4mm-10mm

 5

 Buried/Blind Via

 4-50 layers, 
 board thickness 0.5mm-10mm

 6

 HDI

 1+N+1、2+N+2、
 3+N+3、Anylayer HDI

 7

 Flex & Rigid-Flex PCB

 1-12layers Flex PCB ,2-20layers 
 Rigid-flex PCB HDI+Rigid-flex PCB

 8

 Soldermask Type(LPI)/
 Soldermask color

 kuangshun,Taiyo、 
 Himonia,Nanya,Onstatic,
 Chung Yu,MSDS/Green,
 Yellow, Black, Blue, Red, 
 White,Purple,Orange ,
 Matte Green,Matte Blue,
 Matte Black

 9

 Peelable Soldermask/color

 PETER SD2955/Blue-Green

 10

 Carbon ink

 Nipon

 11

 HASL/Lead Free HASL

 Thickness: 0.5-40um

 12

 OSP

 Entek Plus HT, Preflux F2 LX

 13

 ENIG (Ni-Au)

 Au:0.03um≤max<0.06um 
 Ni:3um≤max≤6um

 14

 Electro-bondable Ni-Au

 Au:0.2-1.0um Ni:2.54-10um

 15

 ENEIPG

 Au: 0.015-0.075um 
 Pd 0.02-0.075um 
 Ni:2-6umm

 16

 Electro. Hard Gold

 Au:5~50uin(0.125~1.27um); 
 Nithickness:100~250uin
 (2.50~6.25um)

 17

 Thick tin

 1.0-1.4um

 18

 Copper thickness

 12oz max.

 19

 Min Mechanical Drill Hole

 0.15mm

 20

 Min. Laser Drill Hole

 4mil (0.100mm)

 21

 Line Width/Spacing

 2mil/2mil

 22

 Max. Panel Size

 650mm X 1200mm

 23

 Line Width/
 Spacing Tolerance

 Non electro coating:+/-5um,
 Electro coating:+/-10um

 24

 PTH Hole Tolerance

 +/-0.002inch(0.050mm)

 25

 NPTH Hole Tolerance

 +/-0.002inch(0.050mm)

 26

 Hole Location Tolerance

 +/-0.002inch(0.050mm)

 27

 Hole to Edge Tolerance

 +/-0.004inch(0.100mm)

 28

 Edge to Edge Tolerance

 +/-0.004inch(0.100mm)

 29

 Layer to Layer Tolerance

 +/-0.003inch(0.075mm)

 30

 Impedance Tolerance

 +/- 10% /Max >50ohm +/- 5%

 31

 Warpage %

 Max ≤0.5%

Capability of Rigid-flex board

 NO.

 Item

 Standard

 1

 Flex & Rigid-Flex PCB

 1-30layers Flex PCB ,
 2-20layers 
 Rigid-flex PCB HDI+
 Rigid-flex PCB

 2

 FCCL(adhesive)

 Shengyi SF305:PI=
 0.5mil&1mil&2mil;
 Cu=0.33oz&0.5oz&1oz

 3

 FCCL(adhesiveless)

 Panasonic R‐F775(ER):
 PI=1mil&2mill;
 Cu=0.33oz&0.5oz &1oz

 DuPont Pyralux 
 AP:PI=1mil&2mil&3mil;
 Cu= 0.5oz&1oz

 4

 Coverlay

 Shengyi SF305C: 0515&
 0525&1025&2030

 Taiflex FHK: 1025&1035

 5

 Adhesive

 Taiflex BT: AD=10um&
 25um& 40um

 shengyi SF302B: 
 AD=35um&40um

 6

 PI stiffener

 Taiflex MHK: PI=3mil,
 5mil, 7mil and 9mil

 7

 3M

 9077&6677&9458

 8

 NO FLOW PP

 Ventec:VT‐47N(TG 170℃)&
 EM‐285B(TG 150℃)

 9

 CCL

 ITEQ: IT‐180A; 
 Shengyi: S1141& S1000‐2

 10

 Other CCL

 Arlon: 85N; Rogers: 
 RO4000 series; 
 Nelco:N4000‐13 series,
 Ventec:VT‐901

 11

 Board thickness

 0.3mm‐3.0mm

 12

 Tolerance of board
  thickness
 (thickness>1.0mm)

 ±10%

 13

 Tolerance of board 
 thickness
 (thickness≤1.0mm)

 ±0.1mm

 14

 Min. board size

 10mm*15mm

 15

 Max. board size

 406.4mm*558.8mm

 16

 Impedance control
  tolerance

 ±10%

 17

 Bow&twist

 0.75%(symmetrical),
 2%(unsymmetrical)

 18

 Min. BGA pad size

 12mil(8mil for electrical
  soft gold board)

 19

 Max. finished 
 copper thickness

 3oz

 20

 Max. buried via

 0.4mm

 21

 Tolerance of 
 non‐plated holes

 ±2mil(limited is +0/‐
 2mil or +2/‐0mil)

 22

 Solder mask color

 green,blue,red, matte green,

 23

 Min. solder dam 
 (copper≤1oz)

 4mil(green, red and blue),
  5mil(black and white)

 24

 Min. solder dam
  (copper2‐4oz)

 8mil

 25

 Min. clearance

 2.5mil (2.0mil)

 26

 Surface treatment

 HASL/LF HASL, 
 ENIG, ENEPIG, 
 Electrolytic Nickel Gold, 
 Soft Gold,Hard Gold,
  Immersion silver,
  Immersion tin and OSP

 Thickness (ENIG)

 0.05‐0.10um

 27

 Nickel thickness
  (ENIG)

 3‐8um

 Gold thickness 
 (ENEPIG)

 0.05‐0.10um

 28

 Palladium thickness 
 (ENEPIG)

 0.05‐0.15um

 Nickel thickness
  (ENEPIG)

 3‐8um

 29

 Hard gold thickness
 (leadless)

 0.1‐1.5um

 Hard gold thickness
 (including lead)

 0.1‐4.0um

 30

 Electrolytic Nickel 
 thickness

 ≥3um

 Electrolytic Gold thickness

 0.05‐0.10um

 31

 Immersion silver thickness

 0.2‐0.4um

 OSP thickness

 0.1‐0.3um

 32

 Tolerance of board outline

 ±6mil(exclude complicated 
 board outline and cutout)

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